KT series high-end lead-free hot air reflow soldering machine

KT series high-end lead-free hot air reflow soldering machine

High production capacity, normal production chain speed up to 160cm/min; low energy consumption, new thermal engineering management system, effectively reduce costs.

Specializing in high-speed production and high-precision PCB packaging processes.

Strong temperature control ability, high temperature control accuracy, set and actual temperature difference within 1.0 ℃; no-load to full-load temperature fluctuation of 1.5 ℃.

Super fast heating and cooling ability, the temperature difference between adjacent temperature zones is within 100 ℃.

The latest heat insulation technology and the new furnace bladder design keep the room temperature +5 ℃ or so.

Nitrogen can be quantitatively controlled throughout the whole process, and independent inspection in each temperature zone shows that the oxygen concentration can be controlled within the range of 50-200PPM.

The latest cooling technology, multi-zone double-sided cooling can be selected; the maximum effective cooling length is 1400mm; to ensure rapid cooling of the product and the lowest outlet temperature.

The new two-stage flux recovery system enables multi-point collection, which fully improves the recovery rate and reduces the maintenance time and frequency for customers.

Double gauge speed change, single machine cost, double production capacity, energy saving up to 65%.