Panasonic SMT Machine NPM-W2
Qiaoyao Technology Products
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Description
Panasonic NPM-W2 electronic component mounting system multi-functional mounting machine, corresponding to the new conceptual equipment (Production Modular) of the mounting change. Mounting and inspection of a coherent system to achieve efficient and high-quality production; high production mode or high-precision mode can be selected according to production requirements; support for large substrates (750 × 550mm) and large components (L150 × W25 × T30mm), dual-track assembly (optional) to achieve high unit area productivity.
basic specifications
| Item | Specification: |
|---|---|
| Model name | NPM-W2 |
| Mounting head (optional assembly) | Lightweight 16 nozzle mounting head V3A, Lightweight 8 nozzle mounting head, 3 nozzle mounting head V2, dispensing head, inspection head, no working head |
| Substrate size | |
| Monorail conveyor belt | Overall installation: L50 × W50mm ~ L750 × W550mm 2 positions: L50 × W50mm ~ L350 × W550mm |
| Two-track conveyor belt | Dual-track transmission (overall): L50 × W50mm ~ L750 × W260mm Dual-track transmission (2 positions): L50 × W50mm ~ L350 × W260mm Monorail conveyor (overall): L50 × W50mm ~ L750 × W510mm Monorail transfer (2 positions): L50 × W50mm ~ L350 × W510mm |
| Power Supply | Three-phase AC 200/220/380/400/420/480V 2.8kVA |
| Air compression source | 0.5MPa, 200L/min (A.N.R.) |
| Dimension | W1280 × D2465 × H1444mm/W1280 × D2340 × H1444mm |
| &Weight | 2850kg/2780kg |
| Mounting Performance (Lightweight 16 Nozzle Mounting Head V3A) | |
| Mounting speed | High Production Mode ON: 42,000 cph (0.086s/ chip) High production mode off: 35,000 cph (0.103s/ chip) 20,800 cph (0.173s/ chip); 8,320 cph (0.433s/ chip); 6,500 cph (0.554s/QFP) |
| Mounting accuracy (Cpk ≥ 1) | ± 40μm/chip (high production mode); ± 30μm/chip (± 25μm is optional); ± 30μm/QFP |
| Component size (mm) | 03015/0402 chip ~ L45 × W45 × T12/T6 0603 chip ~ L120 × W90 × T30/T40, L150 × W25 × T30/T40, L135 × W135 × T13 |
| Braid element supply | Knitting bandwidth: 4/8/12/16/24/32/44/56mm (can be extended to 4 ~ 56/72/88/104mm); Max.120 varieties (4, 8mm knitting) |
| Rod/Pallet Supply | Max.30 variety (single rod feeder); Max.40 variety (double pallet feeder) |
| Dispensing (dispensing head option) | |
| Dispensing speed | 0.16 s/dot (XY = 10mm, Z = within 4mm, no θ rotation); 4.25 s/element (30mm × 30mm corner dispensing) |
| Dispensing position accuracy (Cpk ≥ 1) | ± 75μm/dot; ± 100μm/element |
| Inspection (Inspection head option) | |
| Inspection head | 2D inspection head (A): resolution 18μm, field of view 44.4 × 37.2mm 2D inspection head (B): resolution 9μm, field of view 21.1 × 17.6mm |
| Handling Time | Solder paste inspection 0.35 s/field of view; component inspection 0.5s/ field of view |
| Check Object | Solder paste inspection: chip components 100μm × 150μm or more (0603 or more), packaging components φ150μm or more (B head: 80μm × 120μm or more (0402 or more), φ120μm or more) Component inspection: square chip (above 0603/0402), SOP, QFP, CSP, BGA, aluminum electrolytic capacitor, adjustable resistance, fine-tuning capacitor, coil, connector, etc. |
| Inspection Item | Solder paste inspection: tin infiltration, less tin, offset, abnormal shape, bridging Component inspection: presence or absence of components, offset, positive and negative inversion, different polarity, foreign matter inspection |
| Check position accuracy (Cpk ≥ 1) | ± 20μm (high production mode); ± 10μm |
| Checkpoints | Solder paste check Max.30,000 points/equipment (component points Max.10,000 points/equipment); component check Max.10,000 points/equipment |
noted.The size/weight of the equipment is the standard composition (the main body + 2 ITF trolleys at 30 stations); the mounting speed is measured under the best conditions for our company; 03015/0402 chips require a special suction nozzle and tape feeder; ± 25μm mounting corresponding, 03015 mounting corresponding, T40 thickness,□ 135mm, etc. are optional parts. Please refer to Panasonic's official Specification Manual for details.
